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PCB_PrimitiveVia.create() method

创建过孔

Signature

create(net: string, x: number, y: number, holeDiameter: number, diameter: number, viaType?: EPCB_PrimitiveViaType, designRuleBlindViaName?: string | null, solderMaskExpansion?: IPCB_PrimitiveSolderMaskAndPasteMaskExpansion | null, primitiveLock?: boolean): Promise<IPCB_PrimitiveVia | undefined>;

Parameters

Parameter	Type	Description
net	string	网络名称
x	number	坐标 X
y	number	坐标 Y
holeDiameter	number	孔径
diameter	number	外径
viaType	EPCB_PrimitiveViaType	(Optional) 过孔类型
designRuleBlindViaName	string | null	(Optional) 盲埋孔设计规则项名称，定义过孔的开始层与结束层，null 表示非盲埋孔
solderMaskExpansion	IPCB_PrimitiveSolderMaskAndPasteMaskExpansion | null	(Optional) 阻焊/助焊扩展，null 表示跟随规则
primitiveLock	boolean	(Optional) 是否锁定

Returns

Promise<IPCB_PrimitiveVia | undefined>

过孔图元对象