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IPCB_PrimitiveSolderMaskAndPasteMaskExpansion interface

Solder mask / paste mask expansion

Signature

interface IPCB_PrimitiveSolderMaskAndPasteMaskExpansion

Remarks

This parameter setting includes the following three cases:

1. When the primitive is a top/bottom layer SMD pad, the solder mask/paste mask expansion of the corresponding layer can be set; other settings have no effect

2. When the primitive is a through-hole pad, the solder mask expansion of the top/bottom layer can be set; paste mask expansion settings have no effect

3. When the primitive is a via, the solder mask expansion of the top/bottom layer can be set; paste mask expansion settings have no effect. If it is a blind via, its solder mask expansion setting takes effect according to its exposed layer

The paste mask expansion is generally only used for specific purposes such as stencil production. If you do not understand its function, feel free to ignore its parameter settings

Properties

Property	Modifiers	Type	Description
bottomPasteMask?		number	(Optional) Bottom paste mask expansion
bottomSolderMask?		number	(Optional) Bottom solder mask expansion
topPasteMask?		number	(Optional) Top paste mask expansion
topSolderMask?		number	(Optional) Top solder mask expansion