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PCB_PrimitivePad.create() method

Create Pad

Signature

function create(
	layer: TPCB_LayersOfPad,
	padNumber: string,
	x: number,
	y: number,
	rotation?: number,
	pad?: TPCB_PrimitivePadShape,
	net?: string,
	hole?: TPCB_PrimitivePadHole | null,
	holeOffsetX?: number,
	holeOffsetY?: number,
	holeRotation?: number,
	metallization?: boolean,
	padType?: EPCB_PrimitivePadType,
	specialPad?: TPCB_PrimitiveSpecialPadShape,
	solderMaskAndPasteMaskExpansion?: IPCB_PrimitiveSolderMaskAndPasteMaskExpansion | null,
	heatWelding?: IPCB_PrimitivePadHeatWelding | null,
	primitiveLock?: boolean,
): Promise<IPCB_PrimitivePad | undefined>;

Parameters

Parameter	Type	Description
layer	TPCB_LayersOfPad	Layer
padNumber	string	Pad number
x	number	X position
y	number	Y position
rotation	number	(Optional) Rotation angle
pad	TPCB_PrimitivePadShape	(Optional) Pad shape. This parameter is required before the special pad shape is implemented
net	string	(Optional) Net name
hole	TPCB_PrimitivePadHole | null	(Optional) Hole. null indicates no hole
holeOffsetX	number	(Optional) Hole offset X
holeOffsetY	number	(Optional) Hole offset Y
holeRotation	number	(Optional) Rotation angle of the hole relative to the pad
metallization	boolean	(Optional) Whether the hole wall is plated
padType	EPCB_PrimitivePadType	(Optional) Pad type
specialPad	TPCB_PrimitiveSpecialPadShape	(Optional) Special pad shape. Currently not implemented; please do not use it
solderMaskAndPasteMaskExpansion	IPCB_PrimitiveSolderMaskAndPasteMaskExpansion | null	(Optional) Solder mask/paste mask expansion. null means following the rules
heatWelding	IPCB_PrimitivePadHeatWelding | null	(Optional) Thermal relief optimization parameters
primitiveLock	boolean	(Optional) Whether it is locked

Returns

Promise<IPCB_PrimitivePad | undefined>

Pad primitive object

Example

// 1. 生成随机坐标，避免与画布上已有的焊盘重合
const x = 2000 + Math.floor(Math.random() * 100000);
const y = 2000 + Math.floor(Math.random() * 100000);

// 2. 在顶层（1）创建一个 60x60 圆形贴片焊盘：外形用 ['ELLIPSE', 宽, 高]，无孔传 null
const smd = await eda.pcb_PrimitivePad.create(1, '1', x, y, 0, ['ELLIPSE', 60, 60], '', null, 0, 0, 0, false, 0);

// 3. 在多层（12）创建一个 80x80 通孔焊盘：圆孔直径 35mil，金属化孔壁（沉铜）
const thru = await eda.pcb_PrimitivePad.create(12, '2', x, y + 500, 0, ['ELLIPSE', 80, 80], '', ['ROUND', 35], 0, 0, 0, true, 0);

// 4. 创建类保留现场，不删除图元
console.log('smd padId:', smd.getState_PrimitiveId());
console.log('smd layer:', smd.getState_Layer());
console.log('thru padId:', thru.getState_PrimitiveId());
console.log('thru layer:', thru.getState_Layer());