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PCB_PrimitivePad.modify() method

This API is provided as a beta preview for developers and may change based on feedback that we receive. Do not use this API in a production environment.

修改焊盘

Signature

modify(primitiveId: string | IPCB_PrimitivePad, property: {
        layer?: TPCB_LayersOfPad;
        padNumber?: string;
        x?: number;
        y?: number;
        rotation?: number;
        pad?: TPCB_PrimitivePadShape;
        net?: string;
        hole?: TPCB_PrimitivePadHole | null;
        holeOffsetX?: number;
        holeOffsetY?: number;
        holeRotation?: number;
        metallization?: boolean;
        padFunction?: EPCB_PrimitivePadFunction;
        specialPad?: TPCB_PrimitiveSpecialPadShape;
        solderMaskAndPasteMaskExpansion?: IPCB_PrimitiveSolderMaskAndPasteMaskExpansion | null;
        heatWelding?: IPCB_PrimitivePadHeatWelding | null;
        primitiveLock?: boolean;
    }): Promise<IPCB_PrimitivePad | undefined>;

Parameters

Parameter	Type	Description
primitiveId	string | IPCB_PrimitivePad	图元 ID
property	{ layer?: TPCB_LayersOfPad; padNumber?: string; x?: number; y?: number; rotation?: number; pad?: TPCB_PrimitivePadShape; net?: string; hole?: TPCB_PrimitivePadHole | null; holeOffsetX?: number; holeOffsetY?: number; holeRotation?: number; metallization?: boolean; padFunction?: EPCB_PrimitivePadFunction; specialPad?: TPCB_PrimitiveSpecialPadShape; solderMaskAndPasteMaskExpansion?: IPCB_PrimitiveSolderMaskAndPasteMaskExpansion | null; heatWelding?: IPCB_PrimitivePadHeatWelding | null; primitiveLock?: boolean; }	修改参数

Returns

Promise<IPCB_PrimitivePad | undefined>

焊盘图元对象